发明名称 Cooling device
摘要 A low-cost, fan assisted cooling device (10) is disclosed. The cooling device (10) includes a heat mass (11) with a taper bore (14) therein adapted to receive a heat spreader (40) that has a shape that complement the taper bore (14). The heat mass (11) and the heat spreader (40) are made from dissimilar materials. A fastener (45) or the like can be used to urge the heat spreader (40) and the heat mass (11) into contact with each other. A plurality of vanes (21) are connected with the heat mass (11) and an inside surface (26) of the vanes defined a chamber (30) that surrounds the heat mass (11). A portion of each vane (21) is split into a plurality of fins (23) and both the vanes and the fins (21, 23) have a surface area that increase in a radially outward direction (r) from an axis (Z-Z) of the heat mass (11). <IMAGE>
申请公布号 EP1473982(A2) 申请公布日期 2004.11.03
申请号 EP20040251406 申请日期 2004.03.11
申请人 HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. 发明人 HEDGE, SHANKAR
分类号 F04D29/58;F04D29/60;F28F3/02;H01L23/36;H01L23/40;H01L23/467;H05K7/20 主分类号 F04D29/58
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