发明名称 APPARATUS FOR FIXING LEAD FRAME USING WINDOW CLAMP
摘要 PURPOSE: An apparatus for fixing a lead frame is provided to fix stably an inner lead of the lead frame without delamination by using a window clamp with the first and second protrusion. CONSTITUTION: An apparatus(20) includes a window clamp(23), a pressing part(11) for pressing the window clamp and a heater block(12). The heater block is used for supporting and heating a lead frame(1). The window clamp includes a window(25) for performing wire-bonding between the lead frame and a semiconductor chip(2), the first clamp protrusion(26) for pressing a damper tape(3) on the lead frame and the second clamp protrusion(27) for pressing the lead frame.
申请公布号 KR20040092195(A) 申请公布日期 2004.11.03
申请号 KR20030026429 申请日期 2003.04.25
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 JI, CHANG HWAN;KIM, DONG BIN;KWON, YEONG HAN;LEE, SEONG HUI;LIM, JAE YUN
分类号 H01L21/50 主分类号 H01L21/50
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