| 摘要 |
PURPOSE: A BGA(Ball Grid Array) package is provided to enhance stability and manufacturing yield by using a stack package with improved structure. CONSTITUTION: A BGA package comprises a first substrate(200), a first package(210) attached on the first substrate using ball grid array technique, a second substrate(220) attached on the first package, and a second package(250) attached on the second substrate using ball grid array technique. A wire bonding pad is formed on the front side of the first substrate, and solder balls(260) are attached on the back side of the first substrate. The first substrate is bonded to the second substrate by edge-type pad technique using a wire(230). Epoxy molding process is performed by defining the wire bonding portions. |
