| 摘要 |
<p>A drive circuit (12) is mounted on a metal substrate (50), a control circuit (13) is mounted on an insulating substrate (70), and a large current circuit component such as an electrolytic condenser (18) is mounted on a baseboard (30) integrated with a metallic circuit conductor constituent member (31) by insert molding, in which the metal substrate (50) and the insulating substrate (70) are laminated on the baseboard (30). <IMAGE></p> |
