| 发明名称 |
Press-fit chip package |
| 摘要 |
A press-fit integrated chip package is provided comprising a laminate base structure having plated through holes for introducing press-fit elements, and a laminate cover structure providing very fine conducting paths and having a top mounting plane for mounting chips.
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| 申请公布号 |
US6812560(B2) |
申请公布日期 |
2004.11.02 |
| 申请号 |
US20020192975 |
申请日期 |
2002.07.11 |
| 申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
RECKTENWALD WILLI;SCHETTLER HELMUT |
| 分类号 |
H01L21/60;H05K3/46;(IPC1-7):H01L23/48 |
主分类号 |
H01L21/60 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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