发明名称 |
Reduced formation of asperities in contact micro-structures |
摘要 |
A device comprising movable micro-structures configured to contact a substrate is disclosed. The substrate has a metal-insulator-metal construction with an upper metal layer and an insulator being patterned to provide substrate contact regions to a lower metal layer. The micro-structures have metal under layers for providing ribbon contact regions and non-contact regions. In use, a bias voltage is applied across the micro-structures and the top metal layer of the substrate causing the micro-structures and the substrate to contact through the contact regions. During contact, the contact regions are maintained at a potential that is substantially less than the applied bias voltage, thereby reducing the formation of asperities and/or sticking between contacting parts. The micro-structures are preferably ribbon structures in an optical MEM device configured to modulate light.
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申请公布号 |
US6813059(B2) |
申请公布日期 |
2004.11.02 |
申请号 |
US20020187159 |
申请日期 |
2002.06.28 |
申请人 |
SILICON LIGHT MACHINES, INC. |
发明人 |
HUNTER JAMES;STAKER BRYAN |
分类号 |
B81B3/00;B81C1/00;G02B26/08;(IPC1-7):G02B26/00 |
主分类号 |
B81B3/00 |
代理机构 |
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代理人 |
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地址 |
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