| 摘要 |
A resin-encapsulation method of the present invention for electronic parts by a stencil printing, in which a resin filling opening in a stencil is filled with a resin while a squeezee is being moved over the stencil, is characterized in that elevation control of the squeezee is made in a finish printing process at a position close to an end portion of the resin filling opening on a squeezee movement terminal side so as to scrape the excess of the filing resin out of the resin filling opening. |
