发明名称 |
Method for improving adhesion between dielectric material layers |
摘要 |
This invention provides a method to improve the adhesion between dielectric material layers at the interface thereof, during the manufacture of a semiconductor device. The first step is to form a SiC-based dielectric material layer over a substrate. The SiC-based dielectric material layer is treated by oxygen plasma. A second layer of dielectric material is formed over the SiC-based dielectric material layer.
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申请公布号 |
US6812167(B2) |
申请公布日期 |
2004.11.02 |
申请号 |
US20020163045 |
申请日期 |
2002.06.05 |
申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD |
发明人 |
CHEN YU-HUEI;LI LAIN-JONG |
分类号 |
H01L21/3105;H01L21/312;H01L21/314;(IPC1-7):H01L21/00 |
主分类号 |
H01L21/3105 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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