发明名称 |
METHOD FOR MANUFACTURING WAFER SCALE |
摘要 |
PROBLEM TO BE SOLVED: To provide a method for assembling a wafer scale capable of providing an alignment with high precision between an element such as an image sensor arranged on a wafer and an element such as a lens assembly mounted on the element arranged on the wafer. SOLUTION: The method for assembling a wafer scale comprises the steps of: providing a first element arranged on the wafer a predetermined distance apart from neighboring members; providing a second element; forcedly separating the second element from neighboring members by a predetermined distance; and attaching the second element corresponding to the first element to the wafer in a state of being aligned. COPYRIGHT: (C)2005,JPO&NCIPI
|
申请公布号 |
JP2004304165(A) |
申请公布日期 |
2004.10.28 |
申请号 |
JP20040058701 |
申请日期 |
2004.03.03 |
申请人 |
AGILENT TECHNOL INC |
发明人 |
ERTEL JOHN P;ROBRISH PETER R;HOKE CHARLES D |
分类号 |
H01L27/14;H01L21/68;(IPC1-7):H01L27/14;H04N5/335 |
主分类号 |
H01L27/14 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|