发明名称 METHOD FOR MANUFACTURING WAFER SCALE
摘要 PROBLEM TO BE SOLVED: To provide a method for assembling a wafer scale capable of providing an alignment with high precision between an element such as an image sensor arranged on a wafer and an element such as a lens assembly mounted on the element arranged on the wafer. SOLUTION: The method for assembling a wafer scale comprises the steps of: providing a first element arranged on the wafer a predetermined distance apart from neighboring members; providing a second element; forcedly separating the second element from neighboring members by a predetermined distance; and attaching the second element corresponding to the first element to the wafer in a state of being aligned. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2004304165(A) 申请公布日期 2004.10.28
申请号 JP20040058701 申请日期 2004.03.03
申请人 AGILENT TECHNOL INC 发明人 ERTEL JOHN P;ROBRISH PETER R;HOKE CHARLES D
分类号 H01L27/14;H01L21/68;(IPC1-7):H01L27/14;H04N5/335 主分类号 H01L27/14
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