发明名称 DEVICE FOR MANUFACTURING ELECTRONIC CIRCUIT SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To provide a device for manufacturing an electronic circuit substrate capable of accurately positioning a solder resist pattern at a circuit pattern, and improving the yield of a product. SOLUTION: An ink jet nozzle 2 for discharging liquid droplets of a fluid containing volatile components with which conductive particles are mixed, a laser head 4 for heating, an ink jet nozzle 5 for discharging liquid droplets of a fluid constituted of insulating materials, a laser head 7 for heating and an ink jet nozzle 8 for discharging ink for print are successively arranged so as to face an Y table 33 freely positioned to XY directions on which a substrate 1 is placed. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2004304036(A) 申请公布日期 2004.10.28
申请号 JP20030096786 申请日期 2003.03.31
申请人 HITACHI VIA MECHANICS LTD 发明人 MATSUURA ATSUSHI;KISHI MASAKAZU;YAMAGUCHI TAKESHI;UCHIYAMA BUNJI
分类号 H05K3/28;H05K3/00;H05K3/10;(IPC1-7):H05K3/10 主分类号 H05K3/28
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