| 摘要 |
PROBLEM TO BE SOLVED: To provide a method and apparatus for evaluating the junction potential of different kinds of metal in which contact resistance of multilevel metallization can be measured with high accuracy. SOLUTION: In the method for evaluating multilevel metallization having a junction of different kinds of metal, a plurality of taps of identical structure are arranged on an interconnect line in the vicinity of a contact part and, while regulating the temperature, potential difference between taps is measured at a plurality of applying current levels capable of neglecting joule heating. From correlation of the applying current level and the potential difference, initial potential is determined when the applying current level is 0 by least squares method thus determining junction potential distribution in the vicinity of the contact part. COPYRIGHT: (C)2005,JPO&NCIPI
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