发明名称 |
Film adhesive for sealing, film laminate for sealing and sealing method |
摘要 |
A film adhesive for sealing a plurality of chip-type devices on a substrate at one time, including an adhesive layer of an adhesive composition which exhibits a minimum value of a storage modulus of elasticity before curing from 1x10<3 >to 5x10<5 >Pa measured by using a dynamic visco-elasticity measuring apparatus while elevating the temperature from 80° C. to 150° C. at an elevating temperature rate of 2.4° C./min and at a shearing rate of 6.28 rad/sec and a storage modulus of elasticity after curing from 5x10<5 >to 5x10<7 >Pa measured by using a dynamic visco-elasticity measuring apparatus at a sample temperature of 150° C. in a tensile mode at a measuring frequency of 6.28 rad/sec.
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申请公布号 |
US2004213973(A1) |
申请公布日期 |
2004.10.28 |
申请号 |
US20040813311 |
申请日期 |
2004.03.30 |
申请人 |
HARA TOMIHIRO;ISHII SHIGEYOSHI |
发明人 |
HARA TOMIHIRO;ISHII SHIGEYOSHI |
分类号 |
C08F210/02;C08L23/08;C09J7/02;C09J123/08;C09J163/00;C09J193/04;C09J201/00;H01L21/56;H01L23/29;H01L23/31;H03H3/007;H03H9/10;(IPC1-7):B32B31/00 |
主分类号 |
C08F210/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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