| 发明名称 |
Circuit board and method for manufacturing the circuit board |
| 摘要 |
A circuit board includes a base material, a conductive pattern which is formed on the base material, and a resin layer which is formed on the conductive pattern by a photocurable resin.
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| 申请公布号 |
US2004211979(A1) |
申请公布日期 |
2004.10.28 |
| 申请号 |
US20040824080 |
申请日期 |
2004.04.14 |
| 申请人 |
KONICA MINOLTA HOLDINGS, INC. |
发明人 |
SHIOIRI KAZUYOSHI;YOSHIDA TETSUYA;KAWAHARA YUUSUKE;ICHIKAWA KAZUYOSHI |
| 分类号 |
H05K1/02;H05K3/00;H05K3/12;H05K3/28;H05K3/38;(IPC1-7):H01L31/032 |
主分类号 |
H05K1/02 |
| 代理机构 |
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代理人 |
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