| 摘要 |
PROBLEM TO BE SOLVED: To provide a laminated body in which the wiring of a driver IC chip can be recognized through an insulating layer, adhesion force between a conductor and an insulating body is high, and which can enhance electromigration resistance. SOLUTION: The laminated body has the composition in which the conductor layer and the insulating layer are laminated. And at the same time, the surface on the insulating layer side of the conductor layer is measured as three-dimensional shape data constituted of a height value at each point. A power spectrum as a function is calculated by executing two-dimensional Fourier transform represented by formula (1). The strength of a frequency equivalent to 600 nm is set to the strength equivalent to the surface height value of 1.6μm before the transform. Here, in the formula, F(u, v) is a function (the power spectrum) obtained by the transform, (u) and (v) are wavenumbers in the (x) and (y) directions, f(x, y) is a function (the three-dimensional shape data) of the transform target, and (x, y) are plane coordinates. COPYRIGHT: (C)2005,JPO&NCIPI |
