发明名称 POWDER MOLDING DIE APPARATUS AND POWDER COMPACT MOLDING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a powder compact molding method and a powder molding die apparatus in which lubrication performance is enhanced by forming a lubrication layer with lubricant all over a molded part, molding is performed at higher temperature, and a powder compact of higher density is molded. SOLUTION: A surface-treated layer 11 is formed on a surface 10 of a through hole 1 so as to have a contact angle X with the solution L smaller than a contact angle Y with the solution L in a die 2 itself. Wettability of the solution L in the through hole 10 is enhanced when the solution L is deposited. The solution L is spread all over the surface-treated layer 11, and accordingly, the surface of the through hole 1, and water is evaporated to form a crystallized layer B all over the surface. Molding is performed at higher temperature, and powder molding of higher density is consistently obtained thereby. In addition, the solution L in which lubricant is dissolved in solvent so as to realize uniform phase is deposited on a molded part 1A, the solution L is evaporated, and crystal is formed on the molded part 1A to form the crystallized layer B thereon. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2004298891(A) 申请公布日期 2004.10.28
申请号 JP20030092386 申请日期 2003.03.28
申请人 MITSUBISHI MATERIALS CORP 发明人 NAKAI TAKASHI;KAWASE KINYA
分类号 B30B11/00;B22F3/02;B22F3/03;B22F3/035;B30B11/02;B30B15/00;(IPC1-7):B30B11/00 主分类号 B30B11/00
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