| 摘要 |
<p>In an elongated plate-like contact pin 19 wherein one side surface of each of contact portions 19d on the front side is engaged with/disengaged from a side surface of a solder ball 12b of an IC package as an electric part owing to the elastic deformation of the contact pin, the contact portions 19d have smaller thicknesses at the inner sections thereof than at the outer edge sections thereof in the width direction, and two inclined surfaces 19c engaged with/disengaged from the solder ball 12b are formed, and the normal direction of a contact point of the two inclined surfaces 19c and solder ball 12b is toward the center. The solder ball 12b fits in the small-thickness portions, so that the space can be saved correspondingly compared with a structure having simple flat contact portions. Moreover, the two inclined surfaces 19c guide the solder ball 12b and set it in a predetermined position. The solder ball 12b slides on the inclined surfaces 19c, exhibiting a wiping effect.</p> |
