| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a resin-molded semiconductor device with a heat sink which is assembled easily into an external apparatus and which has an improved yield. <P>SOLUTION: The semiconductor device 1 has a semiconductor switching element 10 in which a first electrode and an electrode for a control are exposed to one main surface side and a second electrode to the other main surface side, a pair of heat dissipating members 2 and 3 arranged in a shape that the element 10 is held and connected electrically and thermally to the first electrode and the second electrode respectively, and a molding resin section 4 filled between a pair of the members 2 and 3. The device 1 has a flexible wiring member 5 which is provided for the input of a control signal and led out to the outside and in which a surface is insulated and worked, and the member 5 is conducted and bonded with the electrode for the control or a terminal for a conductive member connected to the electrode for the control for solving the above-mentioned problem. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
