发明名称 SUBSTRATE INSPECTION DEVICE
摘要 PROBLEM TO BE SOLVED: To reduce the number of wires on a probe frame in a substrate inspection device. SOLUTION: This substrate inspection device is used for inspecting a panel 2a on a substrate by impressing an inspection signal on an electrode 2c formed on the substrate 2. This device is equipped, on the same probe frame 1a, with a probe 1b electrically connected to the electrode 2c to impress the inspection signal on the electrode and at least one signal forming circuit 1c for forming the inspection signal sent to the probe 1b. The probe frame 1a is mounted with the circuits (signal forming circuits) for forming the inspection signal. This makes it possible to reduce the number of wires on the probe frame 1a. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2004301658(A) 申请公布日期 2004.10.28
申请号 JP20030094753 申请日期 2003.03.31
申请人 SHIMADZU CORP 发明人 ISHIDA SHINICHIRO
分类号 G01R31/02;G02F1/13;G02F1/1368;G09F9/00;(IPC1-7):G01R31/02;G02F1/136 主分类号 G01R31/02
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