SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor integrated circuit device which can use an existing platform in an integrated circuit part as it is and has a temperature sensor which can be manufactured without polluting its inside and its manufacturing device. SOLUTION: An integrated circuit part 2 is provided on the surface of a P-type silicon substrate PSub and a multilayer wiring layer M1 in a semiconductor integrated circuit device 1. A temperature sensor part 3 is provided and a sheet member 8 formed of vanadium oxide is provided on an upper layer of the multilayer wiring layer M1. The sheet member 8 and a resistor R are connected in series between a ground potential wiring GND and a power supply potential wiring Vcc, and an output terminal Vout1 is connected to the connection point between the two. COPYRIGHT: (C)2005,JPO&NCIPI