| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of mass producing high quality laminated electronic components. SOLUTION: The manufacturing method comprises an etching process in which an internal conductive material layer 10 is formed in the predetermined pattern in the etching process to a laminated material 14 which is formed by laminating a plurality of layers of insulation material layer 11 and internal conductive material layer 10. In this manufacturing method, the laminated material 14 exposes the internal conductive material layer 10 at both side surfaces provided oppositely. In addition, in the etching process, the etching is performed in the method where at least a pair of laminated layer materials 14, 14 are soaked into the electrolyte under the condition that these are allocated face to face with the side surfaces separated for the predetermined interval. COPYRIGHT: (C)2005,JPO&NCIPI
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