发明名称 FLEXIBLE PRINTED-WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To provide a two-layered flexible printed-wiring board having a high durability for a prolonged term at a high temperature and in high-temperature high-humidity, and having a metallic conductor layer having a high adhesive strength even when a heat and a stress are applied. SOLUTION: In the flexible printed-wiring board in which a metallic evaporated layer is formed on one surface or both surfaces of a plastic film and the conductive metallic layer is laminated on the metallic evaporated layer, the metallic evaporated layer is composed of a layer mainly comprising Ni and Cr and a layer mainly comprising a low-resistant metal, and X and Y are kept within a range that both formula (1): 40≤X≤250 and formula (2): 5.5≤XY/100≤16 are satisfied when the film thickness of the layer mainly comprising Ni and Cr is represented by X (Å) and the content of Cr by Y (%). COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2004303863(A) 申请公布日期 2004.10.28
申请号 JP20030093452 申请日期 2003.03.31
申请人 TOYO METALLIZING CO LTD 发明人 AMIOKA TAKAO;MIYAKE TORU;NAKANO AKINORI
分类号 H05K1/09;B32B15/08;C23C14/14;H05K3/38;(IPC1-7):H05K1/09 主分类号 H05K1/09
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