| 摘要 |
PROBLEM TO BE SOLVED: To improve the reliability of a structure where a bare chip semiconductor device is mounted face down on a circuit board. SOLUTION: The bare chip semiconductor device 10 being mounted face down on a circuit board comprises a substantially rectangular semiconductor substrate 1 having a major surface, and bump electrodes 2 formed on the major surface of the semiconductor substrate. The major surface has a first region R1 in which the bump electrodes are formed within a specified surface density range, and a plurality of second regions R2 in which the bump electrodes are formed under the specified surface density range or no bump electrode is formed. The second regions are separated by the first region and at least two second regions are arranged, respectively, in any one of four angular regions including the angle of the major surface. COPYRIGHT: (C)2005,JPO&NCIPI
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