| 摘要 |
PROBLEM TO BE SOLVED: To provide a die bonding equipment capable of bonding a very thin semiconductor chip tolerable only against a small pressure to a substrate without damaging it. SOLUTION: A capacitive sensor (capacitance C) is provided between a load cell 2 and a grip 7. The sensor 1 has a movable electrode 11, a fixed electrode 12 and a diaphragm 10 and functions as a contact sensor. When a chip 100 touches a substrate 101, the capacitance C increases and thereby the contact between the chip 100 and the substrate 101 can be detected. A linear motor 3 detects the contact when the capacitance C exceeds a specified threshold value and stops the operation. The displacement of the movable electrode 11 from the instance of contact to the detection of the contact is about 0.01μm and the chip 100 receives a small pressure of ten and several [mN], for example. The pressure applied to the chip 100 from the contact of the chip 100 with the substrate 101 to the detection of the contact is sufficiently small as compared with a tolerable stress of the chip 100. COPYRIGHT: (C)2005,JPO&NCIPI
|
