发明名称 Techniques for pin arrangements in circuit chips
摘要 Techniques for improved contact mapping in circuit devices are disclosed. In one particular exemplary embodiment, a technique may be realized as a circuit device comprising a circuit chip having a plurality of electrical contacts positioned at a surface of the circuit chip so as to form one or more channels at the surface, the one or more channels being substantially devoid of electrical contacts such that one or more corresponding channels are formed in a chip carrier for routing electrically conductive traces from one or more of the plurality of electrical contacts on a routing layer of the chip carrier.
申请公布号 US2004212103(A1) 申请公布日期 2004.10.28
申请号 US20040848044 申请日期 2004.05.19
申请人 KWONG HERMAN;WYRZYKOWSKA ANETA;SOH KAH MING;HANDFORTH MARTIN;MARCANTI LARRY 发明人 KWONG HERMAN;WYRZYKOWSKA ANETA;SOH KAH MING;HANDFORTH MARTIN;MARCANTI LARRY
分类号 H01L23/485;H01L23/498;H05K1/00;H05K1/11;H05K3/00;H05K3/42;H05K3/46;(IPC1-7):H01L21/44;H01L23/48 主分类号 H01L23/485
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