| 摘要 |
<P>PROBLEM TO BE SOLVED: To prevent effectively a molding resin for a lead frame for semiconductor devices from forming burrs and being peeled off, by so scheming the groove shape of the folded portion of its lead as to suppress the flow of the molding resin, and to make the length of the flat portion of its outer lead long. <P>SOLUTION: The lead frame for a semiconductor device has an inner lead 4b, an outer lead 4a connected therewith via a step 4c, a groove 2 present between the outer and inner leads 4a, 4b and formed orthogonally to the extended direction of its lead, and the lead so folded that the groove faces the outside, wherein the shape of the groove 2 is so formed that a groove wall 2a present on the side of its outer lead 4a forms an angle of α smaller than 90° with respect to the rear surface 41 of its outer lead. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
