| 摘要 |
PROBLEM TO BE SOLVED: To provide a mounted structure (semiconductor device) suitable for three-dimensionally mounting semiconductor chips of the same size in layers, to provide a method of manufacturing a three-dimensionally mounted semiconductor device through a simplified process, and to provide a spacer suitable for the three-dimensionally mounted semiconductor device. SOLUTION: The semiconductor device 10 is a multilayered three-dimensionally mounted semiconductor device equipped with a plurality of semiconductor chips and spacers 1 interposed between the semiconductor chips. The spacer 1 is equipped with a sheet-like base 2 and an adhesive agent layer 3A provided on the one surface of the base 2, the surface of the spacer 1 bonded to the semiconductor chip is set smaller in area than the surface of the lower semiconductor chip bonded to the spacer 1. The spacer 1 is equipped with the sheet-like base 2 and the an adhesive agent layer provided on both sides of the base 2. The semiconductor chips are all of the same size, and the semiconductor chips are electrically connected to the semiconductor substrate with binding wires. COPYRIGHT: (C)2005,JPO&NCIPI
|
