发明名称 JIG AND METHOD FOR LASER BEAM MACHINING
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a laser beam machining method that has the capability (1) to avoid environmental pollution due to developer, etchant or the like, (2) to suppress deterioration of transmittance of a light transmitting member caused by bubbles and bright points without repeating emission of a laser beam, (3) to flexibly deal with an on-demand type production demand, and (4) to suppress the cost increase of laser beam machining equipment incidental to reinforcement of the moving mechanism of a machining table. <P>SOLUTION: A transparent substrate 100 is temporarily stuck onto a workpiece holding jig 200 on which a laser reflection layer 203 is fixed on the base body 201 with a sticking layer 201. The substrate and the jig are then integrally sucked to the glass plate 5a of the machining table of the laser beam machining device. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p>
申请公布号 JP2004298885(A) 申请公布日期 2004.10.28
申请号 JP20030091958 申请日期 2003.03.28
申请人 RICOH MICROELECTRONICS CO LTD 发明人 KOBAYASHI TAKESHI;KAWAKAMI YASUHIRO
分类号 B23K26/10;B23K26/18;B23K101/42;H01S3/00;(IPC1-7):B23K26/10 主分类号 B23K26/10
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