| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for solding an electronic component by which a solder crack is not formed by forming a large solder fillet even around an electrode for the large-sized electronic component even in a circuit board having a large coefficient of thermal expansion. SOLUTION: In the method for soldering the electronic component by which a land 3 formed on the circuit board 2 and an electrode 11 for the electronic component 1 are soldered by using cream solder 4, the upper section of the land 3 is coated with cream solder 4 while an excess solder 42 coated with cream solder 4 is formed around the land 3, and a solder fillet 41 is formed by cream solder 4 containing the excess solder 42 between the land 3 and the electrode 11 for the electronic component 1, by mounting the electronic component 1 on the land 3 and charging the land 3 into a reflow furnace. COPYRIGHT: (C)2005,JPO&NCIPI
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