| 摘要 |
PROBLEM TO BE SOLVED: To provide a plating device capable of facilitating a thickness control, uniformizing a thickness distribution and reducing the amount of a plating liquid. SOLUTION: In the plating device, the plating is performed while retaining a plating liquid between an electrically conductive sheet and rotating rollers set with intervals from the surface of the electrically conductive sheet. Each rotating roller has ruggedness on the surface, and a mechanism of controlling the intervals between the electrically conductive sheet and the rollers is provided. COPYRIGHT: (C)2005,JPO&NCIPI
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