发明名称 |
Method of electroplating copper over a patterned dielectric layer to enhance process uniformity of a subsequent CMP process |
摘要 |
In a new method of plating metal onto dielectric layers including small diameter vias and large diameter trenches, a surface roughness is created at least on non-patterned regions of the dielectric layer to enhance the uniformity of material removal in a subsequent chemical mechanical polishing (CMP) process.
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申请公布号 |
US2004214423(A1) |
申请公布日期 |
2004.10.28 |
申请号 |
US20030666195 |
申请日期 |
2003.09.19 |
申请人 |
MARXSEN GERD;PREUSSE AXEL;NOPPER MARKUS;MAUERSBERGER FRANK |
发明人 |
MARXSEN GERD;PREUSSE AXEL;NOPPER MARKUS;MAUERSBERGER FRANK |
分类号 |
H01L21/288;H01L21/768;(IPC1-7):H01L21/476;H01L21/44 |
主分类号 |
H01L21/288 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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