发明名称 |
Method of manufacturing semiconductor device, flexible substrate, and semiconductor device |
摘要 |
A semiconductor chip 6 is mounted on a flexible substrate 1 wherein internal connecting electrodes 4 to be connected to protruding electrodes 7 on an element surface of the semiconductor chip 6 and wires 3 for connecting the internal connecting electrodes 4 and the external connecting electrodes to be connected to external devices are provided on a surface of an insulating film 2. The internal connecting electrodes 4, the wires 3 and the surface of the insulating film 2 are coated with a protective film 5. The protruding electrodes 7 and the internal connecting electrodes 4 are connected by arranging the element surface of the semiconductor chip 6 to face the flexible substrate 1 and causing the protruding electrodes 7 on the element surface to pierce the protective film 5. This semiconductor device manufacturing method makes it possible to prevent ion migration and reduce occurrence of short circuit between wires. |
申请公布号 |
US2004214375(A1) |
申请公布日期 |
2004.10.28 |
申请号 |
US20040808398 |
申请日期 |
2004.03.25 |
申请人 |
SHARP KABUSHIKI KAISHA |
发明人 |
NAITOH KATSUYUKI |
分类号 |
G02F1/1345;H01L21/44;H01L21/58;H01L21/60;H01L23/12;H01L23/48;H01L23/498;(IPC1-7):H01L21/44 |
主分类号 |
G02F1/1345 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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