| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method for a multilayer wiring board that is dense and highly reliable in interlayer connection. SOLUTION: This is to form on one side of a carrier metal foil a columnar pattern that will become an interlayer connection part through electroplating in a later step. With the surface of the columnar pattern inside and by putting it upon a first insulating substrate, the columnar pattern is imbedded in the insulating substrate. A first wiring pattern is formed on a surface opposite to that on which the carrier metal foil's columnar pattern is formed. With the first wiring pattern inside, and by putting it over the second insulating substrate, the first wiring pattern is imbedded in a second insulating substrate, thus integrating the first and second insulating substrates. A second wiring pattern electrically connected to the columnar pattern is formed on a table formed by the columnar pattern for interlayer connection and the first insulating substrate. COPYRIGHT: (C)2005,JPO&NCIPI |
