发明名称 |
MULTILAYERED SUBSTRATE AND ELECTRONIC COMPONENT |
摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a multilayered substrate that can improve the temperature characteristic of a circuit and can be reduced in size, and to provide an electronic component using the substrate. <P>SOLUTION: The multilayered substrate 3 is composed of one or more substrates composed of resins or resins containing functional material powder mixed in the resins. At least one layer of the multilayered substrate 3 has dielectric layers 2a and 2b composed of resins containing dielectric powder mixed in the resins and having capacities which become negative in temperature coefficient and capacitor electrodes 5b and 5c sandwiching the dielectric layers 2a and 2b. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
申请公布号 |
JP2004303843(A) |
申请公布日期 |
2004.10.28 |
申请号 |
JP20030092992 |
申请日期 |
2003.03.31 |
申请人 |
TDK CORP |
发明人 |
TAKATANI MINORU;TSUJI YASUSHI;ENDO TOSHIICHI;OKAWA HIROSHIGE |
分类号 |
H01G4/20;H01L23/12;H05K3/46;(IPC1-7):H05K3/46 |
主分类号 |
H01G4/20 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|