| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition for sealing a semiconductor, which has a high flame-retarding effect at a thickness in a wide range in the UL94 test by adding neither a halogen compound nor a phosphorus-containing flame retardant without adversely influencing other physical properties, and a semiconductor device made by using it for sealing a semiconductor element. SOLUTION: This flame-retardant epoxy resin composition comprises essentially an epoxy resin (A), a curing agent (B), a cure accelerator (C), an inorganic filler (D), a compound (W1) having a metal atom and a phenolic compound bonded through an ionic bond or a coordinate bond, and a metal hydroxide (W2), wherein the weight ratio of the (W1) to the (W2) is (0.05 to 5):1 and wherein the ratio of the total weight of the (W1) and the (W2) to the total weight of the epoxy resin (A) and the curing agent (B) is (0.05 to 1.5):1. COPYRIGHT: (C)2005,JPO&NCIPI
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