发明名称 |
Electronic circuit device |
摘要 |
An electronic circuit device, includes: internal terminals; a board on which wirings to the internal terminals are formed; an electronic component that is mounted on the board and is connected with the internal terminals; and an encapsulation resin with which the electronic component and the internal terminals are encapsulated. A part of the wiring forms a ring-shaped portion, and the ring-shaped portion has a plurality of gaps by which the ring-shaped portion is divided into a plurality of discontinuous ring-constituting sections. The plurality of ring-constituting sections are connected to the respective internal terminals, and a coating region of the encapsulation resin is surrounded with the ring-shaped portion. The applied area of the encapsulation resin can be controlled to be constant without using a special element for controlling the flow of the encapsulation resin. |
申请公布号 |
US2004212061(A1) |
申请公布日期 |
2004.10.28 |
申请号 |
US20040829580 |
申请日期 |
2004.04.22 |
申请人 |
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. |
发明人 |
OCHI TAKAO;SHINYASHIKI JUNICHI |
分类号 |
H01L23/28;H01L21/56;H01L23/12;H01L23/24;H01L23/31;(IPC1-7):H01L23/02 |
主分类号 |
H01L23/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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