发明名称 Electronic circuit device
摘要 An electronic circuit device, includes: internal terminals; a board on which wirings to the internal terminals are formed; an electronic component that is mounted on the board and is connected with the internal terminals; and an encapsulation resin with which the electronic component and the internal terminals are encapsulated. A part of the wiring forms a ring-shaped portion, and the ring-shaped portion has a plurality of gaps by which the ring-shaped portion is divided into a plurality of discontinuous ring-constituting sections. The plurality of ring-constituting sections are connected to the respective internal terminals, and a coating region of the encapsulation resin is surrounded with the ring-shaped portion. The applied area of the encapsulation resin can be controlled to be constant without using a special element for controlling the flow of the encapsulation resin.
申请公布号 US2004212061(A1) 申请公布日期 2004.10.28
申请号 US20040829580 申请日期 2004.04.22
申请人 MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. 发明人 OCHI TAKAO;SHINYASHIKI JUNICHI
分类号 H01L23/28;H01L21/56;H01L23/12;H01L23/24;H01L23/31;(IPC1-7):H01L23/02 主分类号 H01L23/28
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