发明名称 SURFACE STRUCTURE OF METALLIC BODY
摘要 PROBLEM TO BE SOLVED: To prevent the diffusion of nickel (Ni) even under high temperature conditions, and to satisfactorily maintain the surface condition of a gold (Au) layer. SOLUTION: In the surface structure of a metallic body where gold (Au) plating is applied to a base member 1 consisting of metal, a nickel (Ni) layer 2 is formed on the surface of the base member 1, a barrier layer 3 consisting of a group 8A metal in the Periodic Table is formed on the surface of the nickel (Ni) layer 2, and further a gold (Au) layer 4 is formed on the surface of the barrier layer 3. Rhodium (Rh) can be used for the barrier layer 3, and stainless steel can be used for the base member 1. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2004300467(A) 申请公布日期 2004.10.28
申请号 JP20030092022 申请日期 2003.03.28
申请人 ALPS ELECTRIC CO LTD 发明人 OTSUKI SOHIKO
分类号 C25D5/26;C23C28/02;C25D7/04;(IPC1-7):C25D5/26 主分类号 C25D5/26
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