| 摘要 |
PROBLEM TO BE SOLVED: To reduce the loss of millimeter waves by accurately integrating an RF module into a millimeter wave transmitting/receiving apparatus while using the RF module to improve the assembly efficiency of the apparatus. SOLUTION: A millimeter wave band transmitting apparatus 30 is provided, in a case body 70, with a substrate 31 with a signal processing circuit formed thereon for applying various kinds of processing to a BS-IF signal inputted from an F-shaped connector 71, and an RF module 41 for converting the BS-IF signal into an RF signal for radiation from a primary radiator. The RF module is fixed in a predetermined position on the substrate. The substrate is equipped with holes H1, H2. Pins P1, P2 provided to the case body are inserted into the holes H1, H2, so that the substrate is located in the predetermined position within the case body. A lid 73 with a lens antenna 90 fitted into a waveguide hole 72 is positioned in an upper portion of the case body 70 by pins P3, P4 and fixed over the case body 70. COPYRIGHT: (C)2005,JPO&NCIPI
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