摘要 |
A lateral airflow fan-sink for electronic devices is introduced to comprise a heat-fin with inter-fin slots and a plurality of axial fans surrounding the heat-fin. The axial fans are mounted individually at ventilating sides of the heat-fin for generating respective forced flow wiping through the inter-fin slots. Thereby, overall heat-dissipation efficiency of the fan-sink can be improved and operational jeopardy from breakdown of all axial fans can be totally removed.
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