发明名称 Lateral airflow fan-sink for electronic devices
摘要 A lateral airflow fan-sink for electronic devices is introduced to comprise a heat-fin with inter-fin slots and a plurality of axial fans surrounding the heat-fin. The axial fans are mounted individually at ventilating sides of the heat-fin for generating respective forced flow wiping through the inter-fin slots. Thereby, overall heat-dissipation efficiency of the fan-sink can be improved and operational jeopardy from breakdown of all axial fans can be totally removed.
申请公布号 US2004212962(A1) 申请公布日期 2004.10.28
申请号 US20030609594 申请日期 2003.07.01
申请人 VIA TECHNOLOGIES, INC. 发明人 KU SHIH-CHANG
分类号 H01L23/467;(IPC1-7):H05K7/20 主分类号 H01L23/467
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