发明名称 |
LAYERED MICROELECTRONIC CONTACT AND METHOD FOR FABRICATING SAME |
摘要 |
A microelectronic spring contact for making electrical contact between a device and a mating substrate and method of making the same are disclosed. The spring contact has a compliant pad adhered to a substrate of the device and spaced apart from a terminal of the device. The compliant pad has a base adhered to the substrate, and side surfaces extending away from the substrate and tapering to a smaller end area distal from the substrate. A trace extends from the terminal of the device over the compliant pad to its end area. At least a portion of the compliant pad end area is covered by the trace, and a portion of the trace that is over the compliant pad is supported by the compliant pad. |
申请公布号 |
WO2004093164(A2) |
申请公布日期 |
2004.10.28 |
申请号 |
WO2004US11116 |
申请日期 |
2004.04.12 |
申请人 |
FORMFACTOR, INC. |
发明人 |
KHANDROS, IGOR, K.;MILLER, CHARLES, A.;WENZEL, STUART, W. |
分类号 |
H01L23/48;H01L23/485;H01R43/00;H05K3/32;H05K3/40 |
主分类号 |
H01L23/48 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|