| 摘要 |
PURPOSE: A thermosetting resin composition for a flatten layer and a flat cured layer formed by using the composition are provided, to improve storage stability, flatness, surface hardness, heat resistance, acid resistance and alkali resistance by using a specific copolymer prepared from a t-butyloxycarbonyl group-containing monomer, a trialkoxysilane group-containing monomer and an epoxy group-containing monomer. CONSTITUTION: The thermosetting resin composition comprises 100 parts by weight of a copolymer prepared by using 0.1-70 parts by weight of a polymerizable monomer containing a t-butyloxycarbonyl group represented by the formula 1, 0.1-50 parts by weight of a polymerizable monomer containing a trialkoxysilane group represented by the formula 2, and 5-80 parts by weight of a polymerizable monomer containing an epoxy group; 1-200 parts by weight of a multifunctional monomer containing at least one ethylenically unsaturated bond; and 5-10,000 parts by weight of a solvent, wherein R1 is H or an alkyl group of C1-C5; R is an alkyl group of C1-C5; R2 is H or an alkyl group of C1-C5; and R3 is H or an aliphatic saturated hydrocarbon group of C1-C6.
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