| 摘要 |
PROBLEM TO BE SOLVED: To provide an adhesive tape for wafer dicing which can easily reduce dicing chips by washing with water, is provided with a heat resisting contraction property prevented from being easily contracted even when it is heated and uniform drawing, and has high transparency and suitable rigidity by which a dicing state can be checked. SOLUTION: In the adhesive tape for dicing which is constituted of forming an adhesive layer for sticking and fixing a wafer on a base material film, the base material film is a single layer film consisting of a mixture of 60-95 wt% one sort or more ethylene-vinyl acetate copolymer containing 5-30 wt% vinyl acetate and 5-40 wt% one sort or more polyolefin resin of which crystallinity is < 20-40 %. COPYRIGHT: (C)2005,JPO&NCIPI |
