Copper based material of law thermal expansion and high thermal conductivity and method for producing the same

摘要

The invention proposes a copper-based material with low thermal expansion and high thermal conductivity having good machinability and adaptability to nickel plating and also proposes a method for producing the same. The copper-based material is prepared through the steps of: adding 5 to 60% of iron-based alloy power having a certain value in thermal expansion coefficient into a matrix powder of pure copper phase powder and/or a precipitation hardening copper alloy powder; mixing the powders together; compacting the obtained powder mixture into a green compact and sintering it at temperatures of 400 to 600° C.