发明名称 Method of vacuum depositing electromagnetic interference layer for mobile phone outer case and vacuum deposition jig therefor
摘要 A method of vacuum depositing an EMI (Electromagnetic Interference) layer using a vacuum deposition jig for a mobile phone outer case is provided. Here, when an EMI layer is fabricated in a mobile phone outer case which finally surrounds mobile phone inner circuit components in order to shield electromagnetic waves harmful for a human body and generated from a mobile phone, an EMI layer is vacuum deposited in a vacuum deposition unit, using a vacuum deposition jig which exposes only a portion where an EMI layer is to be deposited, and fully surrounds the exposed portion in the outer case. Accordingly, in comparison with an existing method, a remarkable effect of interrupting electromagnetic waves is provided and an inferiority ratio is remarkably reduced.
申请公布号 SE0402613(D0) 申请公布日期 2004.10.28
申请号 SE20040002613 申请日期 2004.10.28
申请人 JANG SANG HO 发明人
分类号 C23C14/24;C23C;C23C14/04;C23C14/50;H01R13/658;H04B1/38;H05K9/00;(IPC1-7):C23C/ 主分类号 C23C14/24
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