| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a high-frequency multilayered circuit board that is purposed to miniaturize a circuit. <P>SOLUTION: In a multilayered transmission line, strip conductors of a first triplate line and a second triplate line are connected by a conductor via, and ground conductor layers are connected by a plurality of conductor vias. Conductor vias of an arbitrary height are provided between the ground conductor layers and the strip conductors, one is connected to the ground conductor layers and the other is equipped with a conductor pattern of an arbitrary size to constitute a matching circuit. Thus, a capacitance component between the ground conductors and the strip conductors can be obtained more than a conventional structure of providing matching stabs on the same plane, thereby miniaturizing the circuit. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
