| 摘要 |
PROBLEM TO BE SOLVED: To improve the substrate structure of a temperature compensated piezoelectric oscillator particularly for realizing miniaturization and its manufacturing method. SOLUTION: In the manufacturing method of the piezoelectric oscillator composed of a semiconductor wafer, a piezoelectric vibrator and a lid forming a temperature compensation circuit, the substrate with a desired temperature compensation control terminal disposed in the terminal portion of the semiconductor wafer is used and after desired control is completed and the piezoelectric oscillator is configured, the semiconductor wafer portion forming the control terminal portion is cut off. COPYRIGHT: (C)2005,JPO&NCIPI
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