| 摘要 |
PROBLEM TO BE SOLVED: To solve a problem that a void is formed on an adhesive interface between an organic resin wiring board and a thermosetting resin sealing material or in the resin sealing material by gas volatilized from the board by heat treatment in a method for packaging a semiconductor with which the resin sealing material is applied to a surface whereon a conductor circuit is formed of the organic resin wiring board, a semiconductor device or an electronic component is then press-contacted in a face-down scheme, and electric connection between an electrode of the organic resin sealing wiring board and an electrode of the semiconductor device or of the electronic component and thermosetting of the resin sealing material are simultaneously performed in addition to the heat treatment. SOLUTION: In the method for packaging the semiconductor, the thermosetting resin sealing material that contains a gas scavenger is applied to the surface of the organic resin wiring board whereon the conductor circuit is formed, the semiconductor device or the electronic component is then press-contacted in a face-down scheme, and the electric connection between the electrode of the organic resin wiring board and the electrode of the semiconductor device or of the electronic component and thermosetting of the resin sealing material are simultaneously performed in addition to the heat treatment. COPYRIGHT: (C)2005,JPO&NCIPI
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