SUBSTRATE FOR INTEGRATED CIRCUIT AND ITS MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a substrate for an integrated circuit in which a fine circuit pattern can be formed on a surface and the cost of which is reduced, and to provide its manufacturing method. SOLUTION: The substrate for the integrated circuit has a dielectric substrate having a specified thickness, a film-shaped resin joined with the surface of the dielectric substrate and a copper foil joined with the surface of the resin. The film-shaped resin joined with the dielectric substrate and the copper foil are formed in the specified circuit pattern. The dielectric substrate is composed of ceramics, and the film-shaped resin is composed of a polyimide. COPYRIGHT: (C)2005,JPO&NCIPI