| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for bonding a flexible wiring board by which a short circuit between terminals by a solder in the case of a thermocompression bonding can be prevented by forming a solder collecting section at the front end of the wiring board when the wiring board and a chip are bonded by the solder. SOLUTION: The excess solder overflowing to some recesses by a pressure from an upper section collects at the front end 26 free from thrusting the solder by a capillary phenomenon, by attaching the solder at the FFC terminal 23 and thermocompression-bonding the front end 26 while the front end 26 is extended from a heater chip 25, and a solder collecting section 27 is formed between thermal head chips 13 by floating the front end sections 26. COPYRIGHT: (C)2005,JPO&NCIPI
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