| 摘要 |
PROBLEM TO BE SOLVED: To obtain a curing promoter for providing a thermosetting resin composition, especially an epoxy resin composition with excellent preservability and improved curability, the epoxy resin composition having the excellent properties and to provide a semiconductor apparatus having excellent solder crack resistance and moisture proof reliability. SOLUTION: The curing promoter is mixed with a curable resin composition, promotes the curing reaction of the curable resin composition and is represented by general formula (1) (R<SP>1</SP>, R<SP>2</SP>and R<SP>3</SP>are each a substituted or nonsubstituted monofunctional aromatic group or alkyl group; Ar is a bifunctional aromatic group substituted with a substituent group except a hydroxy group or nonsubstituted; Z<SP>1</SP>is a group to be combined with substituent groups R<SP>4</SP>and R<SP>5</SP>; Z<SP>2</SP>is an organic group to be combined with substituent groups R<SP>6</SP>and R<SP>7</SP>; R<SP>4</SP>, R<SP>5</SP>, R<SP>6</SP>and R<SP>7</SP>are each a group obtained by release of a proton from a monofunctional proton donating substituent group; n is a number of >1). COPYRIGHT: (C)2005,JPO&NCIPI
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