| 发明名称 |
INTERCONNECTION FOR ORGANIC DEVICES |
| 摘要 |
A device having bond pads within a bond pad region, the bond pads comprising a conductive material that is stable when exposed to atmospheric constituents. The bond pads can be formed from conductive oxide materials such as indium tin oxide. A contact layer is provided to enhance the conductivity between the bond pads and the active component of the device.
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| 申请公布号 |
US2004211966(A1) |
申请公布日期 |
2004.10.28 |
| 申请号 |
US20030249625 |
申请日期 |
2003.04.25 |
| 申请人 |
GUENTHER EWALD;LIM HOOI BIN;ABDUL MANAF SHAHROL IZZANNI;EIGENBRODT STEFAN;TENG SOONG LIN |
发明人 |
GUENTHER EWALD;LIM HOOI BIN;ABDUL MANAF SHAHROL IZZANNI;EIGENBRODT STEFAN;TENG SOONG LIN |
| 分类号 |
H01L27/15;H01L27/32;H01L51/52;(IPC1-7):H01L27/15 |
主分类号 |
H01L27/15 |
| 代理机构 |
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